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The First Six-Core Intel Xeon Microprocessor

Uzair Khan1 , Aziz Ansari2 , Meet Yadav3 , Shiburaj Pappu4 , Shakila Shaikh5

Section:Research Paper, Product Type: Journal Paper
Volume-7 , Issue-10 , Page no. 198-200, Oct-2019

CrossRef-DOI:   https://doi.org/10.26438/ijcse/v7i10.198200

Online published on Oct 31, 2019

Copyright © Uzair Khan, Aziz Ansari, Meet Yadav, Shiburaj Pappu, Shakila Shaikh . This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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IEEE Style Citation: Uzair Khan, Aziz Ansari, Meet Yadav, Shiburaj Pappu, Shakila Shaikh, “The First Six-Core Intel Xeon Microprocessor,” International Journal of Computer Sciences and Engineering, Vol.7, Issue.10, pp.198-200, 2019.

MLA Style Citation: Uzair Khan, Aziz Ansari, Meet Yadav, Shiburaj Pappu, Shakila Shaikh "The First Six-Core Intel Xeon Microprocessor." International Journal of Computer Sciences and Engineering 7.10 (2019): 198-200.

APA Style Citation: Uzair Khan, Aziz Ansari, Meet Yadav, Shiburaj Pappu, Shakila Shaikh, (2019). The First Six-Core Intel Xeon Microprocessor. International Journal of Computer Sciences and Engineering, 7(10), 198-200.

BibTex Style Citation:
@article{Khan_2019,
author = {Uzair Khan, Aziz Ansari, Meet Yadav, Shiburaj Pappu, Shakila Shaikh},
title = {The First Six-Core Intel Xeon Microprocessor},
journal = {International Journal of Computer Sciences and Engineering},
issue_date = {10 2019},
volume = {7},
Issue = {10},
month = {10},
year = {2019},
issn = {2347-2693},
pages = {198-200},
url = {https://www.ijcseonline.org/full_paper_view.php?paper_id=4921},
doi = {https://doi.org/10.26438/ijcse/v7i10.198200}
publisher = {IJCSE, Indore, INDIA},
}

RIS Style Citation:
TY - JOUR
DO = {https://doi.org/10.26438/ijcse/v7i10.198200}
UR - https://www.ijcseonline.org/full_paper_view.php?paper_id=4921
TI - The First Six-Core Intel Xeon Microprocessor
T2 - International Journal of Computer Sciences and Engineering
AU - Uzair Khan, Aziz Ansari, Meet Yadav, Shiburaj Pappu, Shakila Shaikh
PY - 2019
DA - 2019/10/31
PB - IJCSE, Indore, INDIA
SP - 198-200
IS - 10
VL - 7
SN - 2347-2693
ER -

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Abstract

This paper describes the next-generation Intels Xeons microprocessor designed for a broad range of highly power-efficient servers, codename Dunnington. The Dunnington processor has six cores (three core-pairs) integrated with large, dense, on-chip caches, and it delivers the dramatic power efficiency of Intel’s 45nm high-K metal gate process and the Intel Core 2 microarchitecture to server platforms. This processor implements a high bandwidth-dedicated interface from each of the three core pairs to the last-level cache (LLC) for the effective use of the inclusive LLC. With high functional integration, large cache size, and 1.9 billion transistors, the processor’s moderate server-class die size of 503mm2 is achieved by optimizing the floor plan and physical design. Thermal Design Power (TDP) limits of 50, 65, 90, and 130W. This processor will be the first part to employ core recovery techniques for reducing product cost

Key-Words / Index Term

Xeon, six cores, Dunnington, 45nm

References

[1] Mistry K. et al. A 45nm Logic Technology with High-k+ Metal Gate Transistors, Strained Silicon, 9 Cu Interconnect Layers, 193nm Dry Patterning, and 100% Pb-free Packaging. International Electron Devices Meeting, December 2007, pp. 247–250.
https://www.intel.com/content/dam/www/public/us/en/documents/research/2008-vol12-iss-3-intel-technology-journal.pdf
[2] Varghese George et al. Penryn: 45nm Next Generation Intel Core 2 Processor. IEEE Association, November 2007.
https://www.intel.com/content/dam/www/public/us/en/documents/research/2008-vol12-iss-3-intel-technology-journal.pdf
[3] Kelin Kuhn et al. Managing Process Variation in Intel’s 45nm CMOS Technology. Intel Technology Journal, Vol. 12, No. 2, 2008.
https://www.intel.com/content/dam/www/public/us/en/documents/research/2008-vol12-iss-3-intel-technology-journal.pdf
[4] Tiwari, R. Sam and S. Shaikh, "Analysis and prediction of churn customers for telecommunication industry," 2017 International Conference on I-SMAC (IoT in Social, Mobile, Analytics and Cloud) (I-SMAC), Palladam, 2017, pp. 218-222. DOI: 10.1109/I-SMAC.2017.8058343
[5] S. Navadia, P. Yadav, J. Thomas and S. Shaikh, "Weather prediction: A novel approach for measuring and analyzing weather data," 2017 International Conference on I-SMAC (IoT in Social, Mobile, Analytics and Cloud) (I-SMAC), Palladam, 2017, pp. 414-417.DOI: 10.1109/I-SMAC.2017.8058382
[6]S. Shaikh, S. Rathi and P. Janrao, "IRuSL: Image Recommendation Using Semantic Link," 2016 8th International Conference on Computational Intelligence and Communication Networks (CICN), Tehri, 2016, pp. 305-308.DOI: 10.1109/CICN.2016.66
[7] S. Shaikh, S. Rathi and P. Janrao, "Recommendation System in E-Commerce Websites: A Graph Based Approached," 2017 IEEE 7th International Advance Computing Conference (IACC), Hyderabad, 2017, pp. 931-934. DOI: 10.1109/IACC.2017.0189
[8] A. Fasiku, Ayodeji Ireti, B. Olawale, Jimoh Babatunde, C. Abiola Oluwatoyin B., "Comparison of Intel Single-Core and Intel Dual-Core Processor Performance", International Journal of Scientific Research in Computer Science and Engineering, Vol.1, Issue.1, pp.1-9, 2013
[9] M. Sora, J. Talukdhar, S. Majumder, P.H Talukdhar, U.Sharmah, "Word level detection of Galo and Adi language using acoustical cues", International Journal of Scientific Research in Computer Science and Engineering, Vol.1, Issue.1, pp.10-13, 2013
[10] Manish Mishra, Piyush Shukla, Rajeev Pandey, "Assessment on different tools used for Simulation of routing for Low power and lossy Networks(RPL)", International Journal of Scientific Research in Network Security and Communication, Vol.7, Issue.4, pp.26-32, 2019